ICT Call 2008ICT08-011

High-Resolution Three-Dimensional Imaging

High-Resolution Three-Dimensional Imaging
Principal Investigator:
High-Resolution Three-Dimensional Imaging
Abgeschlossen (01.01.2009 – 30.06.2012)
€ 540.000

The project involves the design of novel image sensors to be used in high-precision three-dimensional cameras. It aims to revolutionize stereo image sensors and image processing and provide the scientific groundwork for future three-dimensional cameras for roboters, security applications and even three-dimensional TV. It draws on a new high-precision distance measuring method based on optical interference and a new 3D camera chip. For measuring, a laser source working with frequency-shifted feedback adapted to the chip is developed. The test chips are made in standard ASIC foundries in order to check the resolution and precision of the new approaches by way of experiments.


Wir nutzen Cookies auf unserer Website. Einige von ihnen sind technisch notwendig, während andere uns helfen, diese Website zu verbessern oder zusätzliche Funktionalitäten zur Verfügung zu stellen. Weitere Informationen